VeritySEM®
CD-SEM
CRITICAL DIMENSION
Metrex supports the full Applied Materials VeritySEM® Critical Dimension scanning electron microscope (CD-SEM) platforms used for precise pattern measurement and process control throughout semiconductor production. These systems provide sub-nanometer measurement accuracy for critical device features, helping manufacturers maintain tight process control and consistent yield in high-volume environments.
CD-SEM platforms use advanced electron optics, high-resolution beam control, and automated pattern recognition to deliver precise, repeatable metrology at production throughput. Flexible beam conditions and automated measurement routines support a wide range of structures while reducing operator intervention.
Through comprehensive service, remanufacturing, and parts support, Metrex extends the operational life and performance of CD-SEM platforms—minimizing downtime, preserving measurement capability, and maximizing long-term value across the production lifecycle.
All VeritySEM® & NanoSEM™ Platforms
OVERVIEW
Applied Materials VeritySEM® and NanoSEM platforms are CD-SEM systems used for high-resolution imaging and nanoscale analysis in semiconductor manufacturing environments.
Core Capabilities
- High-contrast electron imaging
- Nanoscale measurement and defect review
- Repeatable analysis for process and materials evaluation
Applications
- Failure analysis and diagnostics
- Defect review and structural characterization
- Semiconductor process monitoring
METREX SUPPORT
Metrex provides remanufacturing, installation, and long-term support for VeritySEM® and NanoSEM platforms, helping extend tool life and maintain performance in HVM environments.
WHERE APPLICABLE:
Advanced VeritySEM® Platforms (VeritySEM® 2–5)
- Enhanced detector configurations for improved contrast
- Automated measurement workflows
- Expanded 3D imaging and analysis capabilities
Latest VeritySEM® Platforms (VeritySEM® 4–5)
- Higher throughput and improved measurement stability
- Advanced quantitative analysis features
NanoSEM® Platforms
- Optimized for ultra-fine feature imaging
- Specialized nanoscale characterization workflows
FEATURES
- Optimized for Compound Semiconductor Applications
- Advanced Packaging Compatibility
- Flexible Wafer Handling
- Sub-nm CD and profile metrology
- 3D shape and sidewall analysis
- Multi-layer pattern recognition
- Overlay and automation for HVM fabs
- Low-voltage, low-damage operation
- Supported wafer sizes: (150/200/300 mm)
PRODUCT LINEUP
All CD SEM Platform Product Lines We Support
VeraSEM™ 3D

NanoSEM™ 3D

VeritySEM®

VeritySEM®II

VeritySEM®III

VeritySEM®4i (4i+)

VeritySEM®5i

VeritySEM®6


