SEMVision®
DR-SEM
DEFECT REVIEW
With or without FIB
Metrex supports the full Applied Materials SEMVision® Defect Review SEM (DR-SEM) product family, providing service, parts, and lifecycle support for platforms used as integral components of semiconductor production lines. These systems enable high-throughput, fully automated in-line analysis of defects as small as 30 nm. Defects—such as particles, scratches, or residues—are first identified by a defect detection system, then reviewed and classified on the wafer to determine their origin and impact on yield.
For applications requiring deeper analysis, select SEMVision configurations integrate advanced DR-SEM capability with automated focused ion beam (FIB) technology. This enables rapid cross-sectional analysis of reviewed defects, allowing chipmakers to perform root-cause analysis in minutes without removing wafers from the production flow.
Through comprehensive service, remanufacturing, and parts support, Metrex helps extend the operational life of SEMVision DR-SEM platforms—minimizing downtime, preserving tool capability, and maximizing long-term value.
DR-SEM (With or without FIB)
The Defect Review Scanning Electron Microscope (DR-SEM) provides advanced defect imaging and analysis capabilities for semiconductor substrates, advanced packaging, and high-volume manufacturing (HVM) environments.
Equipped with our patent-pending Z-stage, the DR-SEM offers exceptional versatility—enabling the processing of wafers of varying thicknesses up to 2,000 microns without compromising imaging accuracy or system stability.
Supported Wafer Sizes:
150 mm (6″), 200 mm (8″), 300 mm (12″).
FEATURES
KEY FEATURES:
- High Throughput: Processes up to ~3k DPH (config-dependent), ensuring efficient inspection across production lines.
- High-Resolution, Multi-Perspective Imaging: Enables superior defect recognition and enhances Auto Defect Classification (ADC) accuracy.
- Exceptional Accuracy & Purity: Captures and classifies defects with high fidelity for consistent quality control.
- Seamless Integration: Reads defect files from the host system and outputs reviewed and classified data directly back to the host for streamlined workflow management.
- Optimized for Compound Semiconductor Applications
- Advanced Packaging Compatibility
- Flexible Wafer Handling
- Supported wafer sizes: (150/200/300 mm)
PRODUCT LINEUP
All DR SEM Platform Product Lines We Support
SEMVision®DR-300CX
SEMVision®G2
SEMVision®G3
SEMVision®GX
SEMVision®G4
SEMVision®G5
SEMVision®G6
MULTIPLE SYSTEMS IN STOCK & AVAILABLE FOR PURCHASE NOW.
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QUICK LINKS
CD-SEM
DR-SEM
GT3I
ABOUT
CONTACT
CONTACT
EMAIL: sales@gt3i.com
PHONE: 480-400-6910
PHONE: 800-608-4834
LOCATION: 15936 N 78th St
Scottsdale, AZ 85260
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